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  Emcor  

eReport

March 2008

In This Issue:

ARCHIVED ARTICLE

  • Data Center Meltdown - Gone in 60 Seconds

PRODUCT NEWS

  • WiebeTech Releases DriveBox Enclosure to Store or Carry Hard Drives
  • Elma Offers Slim Version of MicroTCA Portable Chassis
  • High Performance EMI Filtered D-Sub Connectors  Now with Shorter Lead Times
  • Cost-Effective Cooling Solution for Data Center Hot Spots
  • Sola/Hevi-Duty Introduces DIN Rail Mounted Industrial DC UPS
  • New Screwless Top Entry PCB Terminal Blocks From Camden

 INDUSTRY NEWS

  • Vette Corp. Forms Datacom Facilities Division, Focusing on Liquid Cooling Solutions for High-Density Data Center and Telecommunications Systems
  • Littelfuse Launches Next-Generation, Customer-Centered Website
  • Emerson Partners with Cavium Networks to Develop ATCA, AdvancedMC and MicroTCA Packet Processing Blades
  • Hennig Opens New Facility for Enclosure Manufacturing

 EVENT LISTINGS

  • Power Protection Speakers Needed For Remote 2008 Conference and Expo

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Strength, design flexibility, and configure-to-order capabilities make Emcor Enclosure Systems your best choice for electronic equipment protection.

 
ARCHIVED ARTICLE

Data Center Meltdown – Gone in 60 Seconds.
60 seconds is about the time it takes for a 10 kW (kilowatt) cabinet server load in a data center to heat up, initiate a self-protective shut down and cause immeasurable loss of revenue and revenue opportunity as a result of lost data. As much as 22.3 percent of all outages in a data center are caused by servers overheating and shutting down on their own, according to an April 2007 research study conducted by Aperture Research Institute. This is neither fiction nor an incident reserved only for the ultra high density data centers currently under construction.

Continue article at: http://www.equipmentprotectionmagazine.com/images/activeP.pdf  

PRODUCT NEWS

WiebeTech Releases DriveBox Enclosure to Store or Carry Hard Drives
WiebeTech has designed a durable, anti-static storage case to store or transport bare hard drives. The case was designed to complement the RTX TrayFree storage enclosure as a place to hold hard drives when not in the unit. This allows customers to swap out entire RAID sets or transport single drives more safely.

The case is made with textured, anti-static plastic. Reinforced clips on the inside of the case hold the hard drive securely in place, while two spots for labels let users identify the box. A foam pad is included for extra cushion between the case top and drive.


Elma Offers Slim Version of MicroTCA Portable Chassis
Elma Electronic Inc has released its 4U wide MicroTCA Portable Tower. This is a slimmer and more compact version than the 6U wide unit introduced early this year.     
 
The 4U Type 32M MicroTCA Portable Tower features a Star backplane with up to six AMCs. The unit also features one MicroTCA Carrier Hub (MCH) slot and a power module slot. The backplane has a J-Tag Switch Module slot, used for diagnostics. Well suited as a development chassis, the unit facilitates either single or double width format modules in the same backplane. 

The Type 32M features EMC shielding, scratch-resistant vinyl clad aluminum covers, and power components. Cooling is achieved with 2 by 90 CFM fans and the chassis has five temperature sensors throughout the unit. Elma also offers Subrack MicroTCA enclosures in 4U-8U heights and a 1U Pico-style MicroBox.


High Performance EMI Filtered D-Sub Connectors  Now with Shorter Lead Times
Spectrum Control is offering its series 700 D-subminiature filtered connectors in significantly shorter lead times. With their new ceramics facility in full production, Spectrum Control’s in-house ceramic tube production ensures quality with connector lead times as short as two-weeks.
 
Series 700 EMI filtered D-sub connectors are available with feed thru capacitors and Pi filters offering added insertion loss, with capacitance ranges to 5,000pF for feed-thru caps and 4,000pF for Pi filters. These connectors have the unique ability to selectively filter lines allowing signals of various rates to pass without degrading signal integrity.

Spectrum D-subs are available in five shell sizes with termination configurations including PC mount, wire wrap, solder cup and right angle/straight PCB for both pin/socket contacts and as an adapter. In addition, there are many mounting/hardware options available; such as grounded board locks, locking inserts, jackscrews, 4-40 or M3 threads and more.


Cost-Effective Cooling Solution for Data Center Hot Spots
Degree Controls, Inc. (DegreeC), has released the HotSpotr HT-500 under-floor air mover for effective thermal management in data centers. The HotSpotr HT-500 offers localized thermal intelligence by automatically adjusting airflow in front of a rack or groups of racks in the event of thermal rise due to poor airflow, rack density or cooling system failures. This do-it-yourself solution requires no server downtime or rack movement, and can be installed in about a half hour.

The HotSpotr HT-500 utilizes the data center’s existing cold air infrastructure in comparison to the considerable expense associated with installing an additional CRAC unit. The system installs beneath conventional 2 by 2 ft perforated floor tiles wherever additional thermal management is required.

Thermostatic control allows the HotSpotr HT-500 to sense changes in rack intake temperatures. The HotSpotr HT-500 can be used as a stand-alone solution for specific hot spots, or can be integrated into the AdaptivCool Room Scale Thermal Management System. By networking strategically placed HotSpotr HT-500 tiles through a central controller, the AdaptivCool system automatically adjusts the airflow patterns within the data center to supply cold air where it is needed while simultaneously notifying IT professionals of a thermal problem through alarms or automatic text or email messaging.


Sola/Hevi-Duty Introduces DIN Rail Mounted Industrial DC UPS
To ensure industrial end-users maximum uptime and total protection from unexpected DC power disruptions, Sola/Hevi-Duty has introduced the SDU DIN Rail 24 V DC UPS. The system is designed for applications such as industrial computers, robotics, automation and process control.

Available in 10 and 20 amp designs with a choice of two battery modules, the SDU UPS safely mounts on a DIN rail in a control panel, or can be integrated into an enclosure or machine. Its compact modular design offers a wide operational temperature range of 0°C to 50°C to assure reliable power protection to 24 V devices on the factory floor. It delivers the ride-through needed to allow sensitive equipment to safely shutdown during extended power failure, preventing costly data losses, work interruptions and equipment damage.

Additional features for the CDU UPS include an industrial grade steel enclosure, flexible back up battery extensions,  IP20 rated input/output screw terminals, LED indicators, alarms and self-diagnostic capabilities.  Optional features include dry contact I/O communication, USB ports and panel mount bracketing. The new UPS is also UL 508 listed, UL 60950-1 listed and recognized and CE marked.

Are You a UPS Systems/Power Protection Expert?
If so, then you should be speaking at the Remote 2008 Conference and Expo! New session topics include UPS, Flywheel, Back-up and Onsite Power System Technology.

For more information please visit: http://www.remotemagazine.com/rem08_call.php


New Screwless Top Entry PCB Terminal Blocks From Camden
OKW Electronics has launched its new CSTBV23 top entry screwless PCB terminal blocks from Camden Electronics. These compact terminals have been designed with the cable entry and release mechanism positioned on the top face. This makes them well suited for applications where space is at a premium, or there is restricted access.
 
The CSTB23 series provides secure screwless operation allowing cables to be inserted quickly and easily by opening the terminal clamp with a small screwdriver or similar implement. The sprung terminal clamp holds the cable securely in position ensuring a reliable electrical connection. Two standard pitches are offered 5.08 mm and 10.16 mm.

CSTBV23 series terminal blocks are moulded in gray UL94 V-0 flame retardant PA66, and are supplied in single blocks from two to 24 poles (5.0 8mm) and one to 10 poles (10.16 mm). The terminals are rated at 16A/320 V or 16A/630 V with dielectric strength of 2 kV/60s or 3 kV/60s respectively. The cable entry size is 18 AWG to 16 AWG, and the working temperature range is -30˚C to 120˚C.

INDUSTRY NEWS

Vette Corp. Forms Datacom Facilities Division, Focusing on Liquid Cooling Solutions for High-Density Data Center and Telecommunications Systems
Vette Corp. (Vette) has formed a new division focused on liquid cooling for communications services facilities and data center cooling, including high-density server, storage and telecommunications equipment deployments. The recently formed division will utilize Vette's manufacturing, engineering and supply chain logistics resources to provide liquid cooling solutions to communications services facilities and data centers.

"The formation of our datacom facilities division resulted from our ongoing focus on thermal challenges that our OEM customers are now experiencing in facilities where their equipment has been installed,” said George Dannecker, Vette president and CEO. “Data center cooling for high-density data processing equipment has become increasingly complex and expensive. Highly reliable, effective and efficient liquid cooling solutions will replace traditional cooling methods to solve the thermal management needs of our clients."

The management of heat generated by high-density loads is an increasing challenge for facilities with rack-mounted servers and communications equipment. Today a typical blade server rack will generate approximately 12,000 to 30,000 watts of heat in a 7 to 8-square foot enclosure. Current estimates show that up to 63 percent of all data center power consumed is devoted to data center cooling.


Littelfuse Launches Next-Generation, Customer-Centered Website
Littelfuse, Inc. has debuted a new generation of its website (www.littelfuse.com) that features a new Application Design Center and robust search capabilities. Over a year in the making, the new Littelfuse website represents a total overhaul that will enable customers to access the information they need even faster with enhanced application design support.

The new Application Design Center offers design engineers and purchasing professionals a sophisticated yet easy-to-use tool for finding Littelfuse product information based on specific application parameters. It contains an interactive design guide with a library of approximately 50 different applications, allowing users to locate the specific product series or part number that best matches their needs.

“The Application Design Center allows customers to find answers to product inquiries simply by selecting the relevant application information and identifying the circuit they are trying to protect,” said Tom Hovey, E-marketing manager. “Then customers are taken directly to the correct product for that application. In addition, it provides access to design tutorials and support for regulatory issues.”

The revamped Littelfuse website also features upgraded keyword search capabilities that simplify the process of taking visitors to specific information within littelfuse.com.
In addition to its search capabilities, the new site offers improved access to many other popular features, including options for checking inventories, ordering samples, downloading data sheets, cross references between Littlefuse and competitve part numbers, environmental reference data and product certifications.


Emerson Partners with Cavium Networks to Develop ATCA, AdvancedMC and MicroTCA Packet Processing Blades
Emerson Network Power’s Embedded Computing business has partnered with Cavium Networks (to develop a family of high-performance ATCA, AdvancedMC and MicroTCA packet processing blades based on Cavium Networks’ Octeon processor family. The new blades will make it easy for network equipment providers to add scalable, high-performance Level 2 through Level 7 packet processing capability to next-generation, open architecture communications networks.

The Octeon family of multi-core MIPS64 processors provides hardware acceleration for intelligent networking applications requiring high-performance Layer 2 through Layer 7 processing. These software-compatible processors, featuring one to sixteen cnMIPS cores, integrate next-generation networking interfaces, a memory controller, advanced hardware packet processing, QoS, TCP, multi-core scaling, pattern matching, compression/decompression, storage, security and the latest processor peripherals on a single chip.


Hennig Opens New Facility for Enclosure Manufacturing
Capitalizing on the resident strengths of its longtime machine tool enclosure and protection device manufacturing skills, Hennig, Inc. has opened its new location in Rockford, Ill. for the design, engineering and fabrication of enclosures and fuel tanks for power generators and other heavy-duty OEM markets. This new Hennig Enclosure Systems facility occupies more than 16,000 sq. ft. of plant area and is located near the intemodal shipping facility in Rochelle, Ill. 

This new building is a supplementary site to the company’s main facility in Machesney Park, Ill., where Hennig will continue to utilize its laser cutting, water jet cutting, powder coating/ paint line, metal bending machinery and other primary manufacturing equipment to produce the enclosure sections. These enclosure and fuel tank components will then undergo final assembly with the OEM generators at the new facility.
EVENT LISTINGS

Speak at the Remote 2008 Conference and Expo!
The Remote 2008 Conference Program Committee is looking for experts from the power protection, UPS systems, flywheel, battery, back-up and onsite power markets. We’ve recently expanded our Onsite Power program track to better reflect the industry, and we need you to speak! If you think you or your company has what it takes, please visit our Web site below. Submission deadline is April 25th! 

Head to: http://www.remotemagazine.com/rem08_call.php for more information about submitting today!

Regards,
Nick Depperschmidt
Program Chairman

JOB LISTING

Upcoming Industry Events - Click Here to view full Calendar

March 2008

25-28, Kyoto Cooling Summit, Amersfoort, Netherlands,
Contact www.kyotocooling.com

30-April 3, Data Center World Spring, Las Vegas, Nev.
Contact www.datacenterworld.com


April 2008

1-3, APEX, Las Vegas, Nev. Contact www.goipcshows.org

11-17, NAB 2008, Las Vegas, Nev. Contact www.nabshow.com

14-17, MARTS 2008, Chicago, Ill. Contact www.MARTSconference.com

27-May 2, Introp, Las Vegas, Nev. Contact www.interop.com

28 - May 1, BICSI Spring, Nashville, Tn. Contact www.bicsi.org


NAB Show 2008
April 11-17
Las Vegas, NV


This is where it originates...An extraordinary experience, over twice the size of any other tradeshowcentered on content: creation, management,commerce, distribution and delivery. The NAB Show™ is the ultimate destination for a global audience of media professionals who seek to deliver enriched content from concept to consumption...If You See Yourself Here...the NAB Show is Your Show. http://www.nabshow.com/

 

 


3rd Annual Intelligent Tire Technology Conference
April 28-30
Marriott Dearborn Inn Hotel, Dearborn, MI


The 3rd Annual Intelligent Tire Technology Conference will explore new TPMS technologies & TPMS implementation for smarter and safer tire performance.

Register online or by calling 1-800-882-8684.

Conference highlights:

  • Case studies from RFID pioneers with ROI analysis on the impact of RFID implementation on your business
  • Pre-conference workshop in roundtable discussion format on TPMS aftermarket implementation with first-hand market information from industry leaders as well as retail representatives
  • OEM panel discussion with TPMS professionals from Ford, GM, Chrysler and Mitsubishi ensuring seamless communication between OEM and suppliers
  • Technology updates from European industry leaders
  • TPMS market and technology overview for the China market

Speaker faculty: GM, Ford Motor Company, Mitsubishi Motor R&D of America Inc, Chrysler LLC, AUDI AG, Tire Industry Association, Schrader Electronics, NIRA Dynamics AB, Freescale Semiconductor, Goodyear Tire & Rubber Co, Michelin, Robert Bosch GmbH, Continental Engineering Services GmbH, Beru AG, Shanghai Baolong Automotive Corp, Continental Corporation.

www.iqpc.com/us/tiretech/wc


EDS - Where the Electronics Industry Connects
May 5-8, 2008
Las Vegas, NV

EDS -- Where the Electronics Industry Connects—May 5-8, 2008, Paris/Bally’s Hotel, Las Vegas, Nevada  www.edsconnects.com

EDS is North America’s premier venue for business-to-business meetings and networking for the electronics distribution industry. More than 5,000 key representatives from the three major areas of the industry—distribution, manufacturing and professional field sales—attend EDS.  It’s where the “who’s who” in electronics come to build business, including  more international participants than any comparable event in North America. 
EDS is sponsored by industry leaders the Electronic Components, Assemblies and Materials Association (ECA), the Electronics Representatives Association (ERA) and the National Electronic Distributors Association (NEDA).  EDS facilitates sales and marketing partnerships in the global electronics distribution industry. Convened annually since 1937, EDS provides conferences, educational programs, planning sessions, networking opportunities, and a show floor for exhibitors. Complete details and registration information is available at www.edsconnects.com or by calling (312) 648-1140.


Did you miss last month's eReport? You can view previous issues HERE.
Please feel free to forward this message to friends or colleagues in the industry!

Submit editorial content to Nick Depperschmidt at
800.803.9488 X111 or nickd@infowebcom.com

For advertising opportunities, contact Suzanne Harrold at
800.803.9488 X130 or suzanneh@infowebcom.com

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