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Contents of the July/August 2007 Issue
Features
- New Products and Services
- Zero Downtime 2007 Conference Update
- PacStar and Centcom Provide Communications to Afghan National Army
- Trends in Hot Spot Cooling
- Thermal Management and Packaging Challenges of High Power Devices
- Enhanced Thermal Protection with Liquid Cooling
- Taking Protection to the Next Level - Ruggedize Technology and Valuables with Otterbox
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